Understanding and Solving the Poor Moisture Resistance of Soy Adhesives
AdhesivesIndustrial UsesWater resistanceWood
Parent Project:
This is the first year of this project.
Lead Principal Investigator:
Joseph J., Polymer Synergies, LLC
Co-Principal Investigators:
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Brief Project Summary:
The lack of moisture resistance of these adhesives is undoubtedly associated with changes in the molecular structure of the soy proteins in the presence of water. Any change in structure will result in changes of how the soy molecules move. Since the structure and motion of the soy molecules determine how the adhesive performs, it seems logical that this should be studies to help find a solution to poor moisture resistance. Until now this has not been done from a molecular perspective. Solid State Nuclear Magnetic Resonance Spectroscopy (SSNMR) is a molecular spectroscopy technique that allows the researcher to examine both the molecular structure and the molecular motions of the molecules. We propose to use SSNMR to study cured soy adhesives, in the presence and absence of water. If we can understand how water causes a problem in the soy adhesives, we can find a way of solving the problem and growing the use of soy adhesives for industrial applications.
Information And Results
Project Summary

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Progress Of Work

Final Project Results

Our reporting showed that extractable material from the adhesive bond-line is a significant factor relating to the poor moisture resistance of soy-based adhesives crosslinked with polyamideamine-epichlorohydrin (PAE). We previously reported Fourier Transform Infrared Spectroscopy (FTIR) and Solid and Solution Nuclear Magnetic Resonance spectroscopy (NMR) data showing the changes occurring when adhesive films and adhesives from plywood samples were subjected to water soaking. In this final report we have shown that a reaction product of water-soluble protein and cross-linking chemical (PAE) is extracted from the soy adhesive and contributes to the poor moisture resistance of these adhesives used in wood composites.

Benefit To Soybean Farmers

Soy-based adhesives prepared with soy flour, for use in wood composite adhesives, is an area of continued interest for wood composite manufacturers. Since the patenting of these soy-based adhesives for wood composites in 2007, the technology has changed very little and the growth of these adhesives, in the wood composites arena, as well as in other areas of application, has not occurred. A major reason for the lack of growth of these soy-based adhesives in this and other applications is that these adhesives have poor water resistance. Understanding the mechanism of how water affects the chemistry, soy protein structure and resulting strength of the soy adhesive is necessary for finding solutions and solving this poor moisture resistance problem. By studying and benchmarking the physical and chemical properties of the current soy adhesive technology we can then propose possible chemical and physical solutions to the problem of poor moisture resistance of soy adhesives and grow their use in wood composites and other adhesive applications.

The United Soybean Research Retention policy will display final reports with the project once completed but working files will be purged after three years. And financial information after seven years. All pertinent information is in the final report or if you want more information, please contact the project lead at your state soybean organization or principal investigator listed on the project.